Boston, MA, 03/14/2014 – CUI Global Inc (NASDAQ:CUI), a platform company concerned with the activities such as development, acquisition, and commercialization of new, innovative products and technologies has announced that its fully owned subsidiary CUI Inc has launched a new series of digital point of load dc-dc modules which have laid down performance milestones in efficacy, power density, and transient response to cater to the continuously and aggressively rising challenges in distributed power architectures.
The new and innovative module called the NDM3ZS-60 is a non-isolated module which produces 60A in ultra low profile horizontal and vertical packages. This family of non isolated design is the first of its kind to integrate the company’s patented Solus® Power Topology which incorporates the usual buck converter into a SEPIC converter to become a SEPIC driven buck converter. The Topology is capable of reducing switching turn-on losses and switching turn-off losses by as much as 75% and 90%, respectively. CUI’s innovative Solus Topology further enhances efficiency by directing the energy delivery to multiple paths, reducing conduction losses by almost half. The new Topology lets the NDM3ZS-60 to achieve peak performances quickly which is crucial in modern designs.
CUI Global Inc (NASDAQ:CUI)’s President and Chief Executive Officer, William Clough, explained that the world market for digital power is foreseen to be worth $12.4 billion in three years, as reported by HIS, which is a global information company.
At APEC, 2014
CUI Global Inc (NASDAQ:CUI) will be demonstrating the NDM3ZS-60 and the other products in its Novum Advanced Power line at the Applied Power Electronics Conference (APEC), 2014. CUI Inc will be located at booth 1233 in the show, which is to be held in Forth Worth, Texas from March 16 to March 20, 2014. In the show, CUI Global Inc (NASDAQ:CUI) will exhibit its array of advanced power modules, including digital point of load dc-dc and advanced intermediate bus.